Description:
Tyndall National Institute at University College Cork invites applications for the position of Principal Engineer - Bioelectronics Packaging. You will collaborate with multi-disciplinary, industry-aligned researchers with expertise in microsystems technology, wireless, biochemical, MEMS, biophotonic and other sensor platforms as well as low power electronic system hardware and software design to execute industry-defined applied research projects. Reporting to the Head of the Bioelectronics Strategic Research Cluster in Tyndall, this is an exciting opportunity for you to help define and implement research projects in a variety of fast-moving, industry-relevant areas.
Activities will include applied research implementation, development of electronic system integration and packaging solutions, team building, project management, researcher supervision, travel to project meetings at customer / partner sites as applicable, and to international conferences, workshops, industry meetings and project proposal meetings.
As Principal Engineer - Bioelectronics Packaging, you will lead and coordinate activities and projects related to the packaging specification, design and deployment of selected smart sensor systems, incorporating the necessary communications, data processing, sensor / actuator interfacing and power supply modules needed to enable specified healthtech industry defined applications. You will drive the specification, design, integration and testing of packaging solutions for minimally invasive / implantable devices, in accordance with standards and processes as applicable to digital healthtech industry defined applications.
You will lead a newly established Bioelectronics Packaging team involved in the packaging and assembly of healthtech sensor systems, with the following responsibilities:
- Drive research innovation in healthtech systems packaging within the Bioelectronics Packaging Team and through collaborations with other Tyndall groups as part of the Tyndall Bioelectronics Cluster, proactively driving annual objective setting with the group;
- Provide leadership of a digital healthtech systems integration and assembly engineering capability; development of a team strategic vision with the collaborative input of group members and other key stakeholders;
- Lead a portfolio of collaborative projects with strategic industry, clinical and/or academic partners for digital healthtech sensor systems;
- Ensure excellence in the delivery of all research outputs, including technical reports, prototypes and demonstrators, filed intellectual property, and peer reviewed publications;
- Develop new proposals and projects in line with Tyndall National Institute’s 2025 strategy;
- Engage relevant stakeholders including multinational and indigenous companies, clinical groups, industry organisations, funding agencies, and representatives of Government departments;
- Identification of future engineering challenges and solutions that meet the needs of customers and other stakeholders; partner with Tyndall’s Business Development, and ICT for Health team to engage with customers and collaborators to scope out new projects;
- Successful recruitment of high calibre engineering talent on an ongoing basis;
- Pro-actively supports senior management in developing long term strategic technology R&D direction;
- Actively pursue/obtain appropriate media coverage for the technology work of the group;
- Act as a role model and drive the importance of Education and Public Engagement with staff;
- Take a leadership role across a range of settings and objectives including those outside of their immediate work area; consistently review personal/team performance and set challenging goals and targets;
- Ensure all outputs are delivered to a high standard of excellence and in an efficient manner;
- Organisation of internal/external workshops and/or conferences with internal and external customers.
- Participate in education and public engagement activities, as required.
- Ensure all activities are compliant with the Tyndall Quality Management system.
- Ensure all activities are compliant with the required Health and Safety standards.
- Carry out any additional duties as may reasonably be required within the general scope and level of the post.
Essential Criteria
- An Honours degree in a relevant discipline of science or engineering, with typically several years relevant senior engineering experience;
- Demonstrated track record of excellence at international level in research through industrial and/or academic experience, in the development of electronic system integration platforms such as advanced packaging and assembly for smart sensor systems. Track record of research excellence outputs should be evidenced by granted patents and/or publications;
- Demonstrated ability to work independently on electronic packaging projects and in leadership of larger multi-disciplinary and cross-functional research teams and projects, together with evidence of a lead technical role in research projects;
- Track record of leading a team of independent Engineers and a demonstrated ability in personnel management, R&D team management, and in mentoring and coaching staff in the advancement of their careers;
- Significant experience in engaging in knowledge / technology transfer and innovation activity to deliver impact to internal/external stakeholders, including experience of transferring ICT related devices from R&D to scale-up manufacturing;
- Extensive experience in managing multiple and very complex projects in industrial and/or academic environments;
- Evidence of defining the strategic direction for technology teams and credible experience in, or potential for, preparation of competitive research proposals such as industry, national and / or international funding opportunities.
- A postgraduate qualification in technology and/or business;
- Has attained the top level of professional accreditation through ongoing professional development of their own career and drives this ethos in other team members;
- Recipient of external engineering awards and/or acknowledgement;
- Strong technical competence related to electronic packaging of systems for life sciences applications including medtech and/or biopharma, such as wearable, minimally invasive, and/or implantable digital healthtech;
- Experience in design of electronic packaging solutions in compliance with EU / FDA medical device regulations;
- Strong communication and negotiation skills;
- Experience at an advanced stage in creating a technology spin-out via the creation of, or involvement with, a start-up.