Principal Researcher

Description:

• Drive both the electrical and packaging design of miniaturized power solutions from ULP to IVR
• Specify the electrical performance requirements of advanced magnetic components appropriate for PSiP, PwrSoC
• Coordinate cross-functional teams to prototype, fabricate, test and integrate systems which involve, chipscale power semis, advanced substrate based or on Si magnetics, and advanced controller IC chiplets
• Deliver research outputs that result in high impact-factor journal publications, advanced functional prototypes, simulation models, patents and technology licenses
• Supervision, recruitment and development of graduate students, engineers and researchers
• Operate under Tyndall’s Health and Safety and Quality Systems protocols
• Participate in Education and Public Engagement activities, as required
• Ensure all activities are compliant with the Tyndall Quality Management system
• Ensure all activities are compliant with the required Health and Safety standards
• Carry out any additional duties as may reasonably be required within the general scope and level of the post
   

Essential Criteria
 

• Engineering degree in Electronics or equivalent industry research experience, ideally with interdisciplinary collaboration with power electronics experts across mechanical, packaging, thermal disciplines, with relevant post graduate experience
• Strong Experience in PCB Layout and 3D Integrated Packaging Design
• Strong experience in Circuit Design and Simulation
• Strong experience with switch-mode power converter design
• A significant tier-one publishing and/or patenting record
• Demonstrated capability in managing, supervising and undertaking research projects
• Evidence of excellent analytical, organizational, communication, project management & time management skills motivated by ambition
   

Desirable Criteria
 

• Evidence of creative skills/creativity
• Experience in packaging and heterogeneous system integration for power electronics
• Strong experience with magnetic component device design is a distinct advantage
• Track record in delivering world-leading research in as many as possible of the following – (i) electronic design, (ii) modelling, (iii) test, (iv) characterization, (v) optimization and integration of power solutions for ULP wireless IoT edge and/or IVR point of load devices
• Capability of designing and modelling of magnetic devices using CAD software, such as Ansoft Maxwell or HFSS or Thermal CAD
• Good understanding of PCB/substrate design and construction techniques